Detailed Product Description

Semi Rigid, 1:1 Mixing ratio, Epoxy Potting and Encapsulating Compounds

Description:

E-750/H-185 is two parts, semi rigid epoxy resin.  It is designed for protecting sensitive electronic components from impact, shock, vibration, heat, conductivity, moisture, chemical and visual inspection.

Features:

1.      Good transparency, low viscosity, easy to handle.

2.      Can be cured either at room temperature or elevated temperature.

3.      Excellent adhesion properties with a variety of materials, such as metal (e.g. brass, iron, gold, silver), non-metals (e.g. rock, wood, paper and glass, etc)

4.      The cured compound become a film with excellent mechanical properties, such as compressive, flexural, tensile strength resistanceand electrical properties.

5.      Excellent weather resistance.

6.      The cured resin has good bright and smooth surface.

7.       

Typical Properties:

                                          E-750                 H-750

Appearance                              Clear liquid         Light yellow liquid

Viscosity (100g, 25)                      6,000-7,000              100-150

Mixing Information:

Ratio by weight                               1          :             1

Curing:

Pot life (25, 100g)                                1 hour

Curing time                    - Room Temperature: 16 24hours (follow the thickness of the film), or

                                   - 60 × 1~2 hours

Typical Physical Properties:

Hardness                                            Shore A 60~67