Detailed Product Description

Descriptions:

E759/H759 is a two component, modified, medium viscosity epoxy potting compounds.  It is used as electrical/electronic potting, casting and encapsulating.  The elastic and low shrinkage characteristics are best suited for sensitive electrical and electronic components.

Features:

1.      The cured resin is elastic, offering excellent thermal and mechanical shock resistance.

2.      The internal stress occurred during curing process is very slight, harmless to delicate electrical and electronic components potting.

3.      Flame retardant recognized under UL-94v0.

4.      Simple mixing and easy handling.

5.      Good adhesive strength and thermal conductivity.

6.      Can be cured either at room temperature or elevated temperature.

7.      Excellent chemical resistance and water resistance.

2.      Dont expose the material directly under sun.

Self Life:

E-759/H-759 is stable for 6~8 months when store at a dark, dry and cool place below 25 in original, unopened containers.

Appearance                     --                            Black Liquid     Light Brown Liquid

Viscosity25               cps                            35,000~40,000           300

Viscosity (mixture)               cps                                      2,500~3,000

Mixing Ratio (by weight)                                             100         :         30

Pot Life (100g, 25)                          approx. 1 hours

Initial curing time                             10~12 hours (room temperature, follow the thickness to be applied)

Fully cure                                  R.T.: 7 days, or 50~60 x 2 hours + 80 x 2 hours

Dielectric Constant                                           4.3 (1khz)

Breakdown Voltage                                          ↑15 kvs