Detailed Product Description

FONG YONG HEAT SINK COMPOUND/ THERMAL COMPOUND SYSTEM is a white paste silicone product which is heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal

oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. This system is very

stable to the change of temperature. It helps to maintain a positive heat sink seal that improves heat transfer from

the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices.

Uses:

FONG YONG HEAT SINK COMPOUND/ THERMAL COMPOUND SYSTEM is used to the base and mounting studs of transistors, diodes, CPU heat sinks, computer cooling, CPU cooling systems, thermal heat transfer, and silicon-controlled rectifiers. It can be also served as a thermal coupler for many heat sink devices where efficient cooling is required. This system has also been applied as a high voltage corona-suppressant, non-flammable coating in connections for fly-back transformers in TV sets and similar applications.