Detailed Product Description

FONG YONG ELECTRONIC GRADE POTTING/CASTING/ENCAPSULATING/SEALING/ADHESIVE COMPOUND are used to protect, insulate, and conceal electrical and electronic circuitry, components, and devices. We supply four systems to satisfy various requiremetns:

1. Epoxy resins: rigid/flexible

    - Room temperature cure

    - Elevated temperature cure

    -UL94v0

    - RoHS

    - Availability for various color requirements

2. Polyurethane resin: rigid/flexible

    -RoHS

    - Elevated temperature cure

    - Availability for various color requirements.

3. UV curable resins: rigid/flexible

4. Silicone compound:

    -UL94v0

    - Room temperature cure

    - Elevated temperature cure

Please IMMEDIATELY write us a message for more information.  We are ready to provide our best product and service to you.

Look forward to hearing from you soon.